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| Preliminary Data Sheet * FEATURES 21 dBm Output Power at 1-dB Compression at 18 GHz 12.5 dB Power Gain at 18 GHz 55% Power-Added Efficiency Source Vias to Backside Metallization FPDA200V HIGH PERFORMANCE PHEMT WITH SOURCE VIAS GATE BOND PAD DRAIN BOND PAD DIE SIZE: 15.6X13.2 mils (395x335 m) DIE THICKNESS: 3.9 mils (100 m) BONDING PADS: 3.1X3.1 mils (80x80 m) * DESCRIPTION AND APPLICATIONS The FPDA200V is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs) Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an Electron-Beam directwrite 0.25 m by 200 m Schottky barrier gate. The recessed "mushroom" gate structure minimizes parasitic gate-source and gate resistances. The epitaxial structure and processing have been optimized for high dynamic range. Typical applications include high dynamic range driver stages for commercial applications including wireless infrastructure systems, broad bandwidth amplifiers, and optical systems. Source vias have been added for improved performance and assembly convenience. Each via hole has 0.02 nH of inductance. Additionally, the via holes remove the need for source bond wires, meaning only two bond wires are required for assembly. Because the via connects the source pad to the backside metallization, self-bias configurations should be designed with caution. * ELECTRICAL SPECIFICATIONS @ TAmbient = 25C Parameter Saturated Drain-Source Current Power at 1-dB Compression Power Gain at 1-dB Compression Power-Added Efficiency Maximum Drain-Source Current Transconductance Gate-Source Leakage Current Pinch-Off Voltage Gate-Source Breakdown Voltage Magnitude Gate-Drain Breakdown Voltage Magnitude Thermal Resistivity frequency=18 GHz Symbol IDSS P-1dB G-1dB PAE IMAX GM IGSO VP |VBDGS| |VBDGD| JC Test Conditions VDS = 2 V; VGS = 0 V VDS = 5 V; IDS = 50% IDSS VDS = 5 V; IDS = 50% IDSS VDS = 5 V; IDS = 50% IDSS VDS = 2 V; VGS = 1 V VDS = 2 V; VGS = 0 V VGS = -5 V VDS = 2 V; IDS = 1 mA IGS = 1 mA IGD = 1 mA -0.25 6 8 50 Min 40 19 11 Typ 60 21 12.5 55 125 70 1 -0.8 7 9 260 10 -1.5 Max 85 Units mA dBm dB % mA mS A V V V C/W Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 2/25/02 Email: sales@filss.com Preliminary Data Sheet * ABSOLUTE MAXIMUM RATINGS Parameter Drain-Source Voltage Gate-Source Voltage Drain-Source Current Gate Current RF Input Power Channel Operating Temperature Storage Temperature Total Power Dissipation Notes: * * Symbol VDS VGS IDS IG PIN TCH TSTG PTOT Test Conditions TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C -- TAmbient = 22 3 C FPDA200V HIGH PERFORMANCE PHEMT WITH SOURCE VIAS Min Max 8 -3 2xIDSS 10 100 175 Units V V mA mA mW C C mW -65 175 550 * Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power Absolute Maximum Power Dissipation to be de-rated as follows above 25C: PTOT= 550mW - (3.7mW/C) x THS where THS = heatsink or ambient temperature. * HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. APPLICATIONS NOTES & DESIGN DATA Applications Notes are available from your local Filtronic Sales Representative or directly from the factory. Complete design data, including S-parameters, noise data, and large-signal models are available on the Filtronic web site. * * Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 2/25/02 Email: sales@filss.com Preliminary Data Sheet FPDA200V HIGH PERFORMANCE PHEMT WITH SOURCE VIAS Units in microns All information and specifications are subject to change without notice. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 2/25/02 Email: sales@filss.com |
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